S’wak’s SMD Semiconductor to provide chip design services to Germany’s X-FAB

27 Mar 2023 • 1:47 PM MYT
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S’wak’s SMD Semiconductor to provide chip design services to Germany’s X-FAB

KUCHING – Sarawak Microelectronics Design (SMD) Semiconductor Sdn Bhd, a wholly owned subsidiary of Sarawak Research and Development Council, today signed a framework services agreement (FSA) with Germany’s X-FAB Global Services to provide chip design services. 

The agreement was signed by SMD Semiconductor chief executive officer Shariman Jamil, its director Peter Morin Nissom, X-FAB Group CEO Rudi de Winter, and group chief technology officer Joerg Doblaski.

The FSA exchange ceremony was witnessed by Sarawak Premier Tan Sri Abang Johari Tun Openg; state Education, Innovation, and Talent Development Minister Datuk Roland Sagah Wee Inn and his deputy Datuk Dr Annuar Rapaeep; Sarawak Financial Secretary Datuk Seri Wan Lizozman Wan Omar, and X-FAB Silicon Foundries SE chairman Tan Sri Hamid Bugo.

Through the agreement, SMD will render chip designs to X-FAB to develop X-FAB’s latest silicon IP libraries for their advanced process technology node migration.

“This activity also aligns with X-FAB’s expansion plan at the Samajaya facility in Kuching to increase the foundry output from 30,000 to 40,000 wafers per month by 2025,” SMD Semiconductor said in a statement today.

Meanwhile, Abang Johari, who spoke at the ceremony, said the agreement also signified the Sarawak government’s commitment to gear its industry towards the fourth industrial revolution and a high-value economy.

He also hoped that Sarawakian semiconductor professionals working overseas would return to contribute to the state’s industry through this initiative.

“SMD’s collaboration withX-FAB Global Services will make Sarawak a major player in the global supply chain and enable higher-skilled job creations,” he added. – Bernama, March 27, 2023

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